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Measurement and Control of Copper Additives in Ele...
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Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography
todd-linden
Team TFS
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on
10-09-2014
01:25 PM
Recently, copper has been incorporated into the fine wires (down to nanometer widths) in integrated chips, requiring careful control of the plating process.
Labels:
Liquid Chromatography
White Paper
WP-71211-HPLC-Copper-Additives-Plating-Baths-WP71211-EN.pdf
3377 KB
Version history
Last update:
10-09-2014
01:25 PM
Updated by:
todd-linden